Lee HillClass I – Lee Hill, Silent Solutions, Amherst, NH, USA

Lee Hill is Founding Partner of SILENT Solutions LLC, an independent electromagnetic compatibility (EMC) and RF design firm established in 1992. Besides providing EMC design review and troubleshooting services, Lee is a member of adjunct faculty at Worcester Polytechnic Institute (WPI), an EMC class instructor at the University of Oxford (England), and an EMC instructor for the IEEE EMC Society’s annual Global University program and EMC Fundamentals workshop. He has also served as an EMC instructor for UC Berkeley Extension, Hewlett-Packard, Agilent, Freescale Semiconductor, and General Motors University.

Previously Lee was Principal EMC and Systems Engineer at Digital Equipment Corporation’s Workstation Systems Engineering Group in Palo Alto, California.
Lee received the Master of Science Degree in Electrical Engineering & Electromagnetics with highest honors from the University of Missouri-Rolla EMC Laboratory, (now Missouri University of Science and Technology).

Lee has over twenty-five years of experience in the EMC design and retrofit of complex electronic systems. He has been teaching short courses on EMC design and troubleshooting for twenty years. Lee consults and teaches worldwide, and has presented classes in Taiwan, Singapore, Mexico, Norway, Canada, South Korea, France, and United Kingdom. He has completed a three-year term on the Editorial Review Board of Printed Circuit Design Magazine. Lee is the named inventor of three US patents for EMI control in electronic systems, and provides expert witness services for patent litigation. He was awarded the 1993 IEEE EMC Society President’s Memorial Scholarship and the 1994 Missouri Collegiate Entrepreneur Award.

Lee is a past member of the Society’s Board of Directors (2004-2007), and also served as a member of the Society’s Awards Committee. In 1994, Lee was appointed to serve a two year term as an IEEE EMC Society Distinguished Lecturer (DL), and from 1999-2006 he served as chair of the DL program. In 2003 he served as Co-Technical Chair of the IEEE Symposium on EMC in Boston, Massachusetts. He is a past Vice-Chair of the Central New England Chapter of the IEEE EMC Society. In the past fifteen years he has been a frequent featured speaker at IEEE EMC Society fundraising events in cities throughout the US including Santa Clara, Seattle, Portland, Chicago, Milwaukee, Dallas/Fort Worth and Detroit. He has also provided technical presentations to Society chapters in Los Angeles, San Diego, Boston, Austin, Colorado Springs, Pittsburgh, and Orange County, CA. In 1999 Lee received a Certificate of Appreciation from the EMC Society for significant contributions to education through his annual participation in the Demonstrations and Experiments portion of annual IEEE EMC Symposia. Lee was a member of the original IEEE P1180 ad-hoc committee on low frequency magnetic field measurement for video display terminals.

Todd HubingClass II - Todd Hubing, Clemson University, Clemson, SC, USA

Dr. Todd Hubing is the Michelin Professor of Vehicle Electronic Systems Integration at Clemson University and Director of the Clemson Vehicular Electronics Laboratory (CVEL). His research focuses on the design of electronic components and systems that work safely and reliably in automotive environments. He holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer with IBM for 7 years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson University in 2006. At Clemson, he teaches classes in vehicle electronics, electromagnetic compatibility and digital signal integrity. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the Applied Computational Electromagnetics Society, and a Past-President of the IEEE Electromagnetic Compatibility Society.

Jun FanClass III –– Jun Fan, Missouri University of Science and Technology, Rolla, MO, USA

Jun Fan (S’97-M’00-SM’06) received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2000. From 2000 to 2007, he worked for NCR Corporation, San Diego, CA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), and is currently an Associate Professor with the Missouri S&T EMC Laboratory. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. Dr. Fan served as the Chair of the IEEE EMC Society TC-9 Computational Electromagnetics Committee from 2006 to 2008, and was a Distinguished Lecturer of the IEEE EMC Society in 2007 and 2008. He currently serves as the Chair of the Technical Advisory Committee of the IEEE EMC Society, and is an associate editor for the IEEE Transactions on Electromagnetic Compatibility and EMC Magazine. Dr. Fan received an IEEE EMC Society Technical Achievement Award in August 2009.

Ege EnginClass IV –– Ege Engin, San Diego State University, San Diego, CA, USA

Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. From 2001 to 2004 he was with the Fraunhofer-Institute for Reliability and Microintegration in Berlin. During this time he also received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany. From 2005 to 2008, Dr. Engin was with the Packaging Research Center at Georgia Tech, where he was an Assistant Director of Research. Since 2008, he is with the Electrical and Computer Engineering Department of San Diego State University.

He has more than 100 publications in journals and conferences in the areas of signal and power integrity modeling and simulation, 4 patents, and has presented tutorials in international conferences in the area of high-speed design. He is the co-author of the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007.

Dr. Engin is the recipient of the Semiconductor Research Corporation Inventor Recognition Award in 2009. He has co-authored publications that received the Outstanding Poster Paper Award in the Electronic Components and Technology Conference (ECTC) 2006, Best Paper Award Finalist in the Board-Level Design Category at DesignCon 2007, and Best Paper of the Session Award in IMAPS Advanced Technology Workshop on RF and Microwave Packaging 2009.

Tzong-LinClass V – Tzong-Lin Wu, National Taiwan University, Taipei, Taiwan

Tzong-Lin Wu, received the B.S.E.E. and Ph.D. degrees from National Taiwan University (NTU), in 1991 and 1995, respectively. From 1995 to 1996, Tzong-Lin was a Senior Engineer at Micro-electronics Technology Inc., in Hsinchu, Taiwan. In 1996, after receiving his Ph.D. degree, he joined the Central Research Institute of the Tatung Company, Taipei, Taiwan, where he was involved in the analysis and measurement of electromagnetic compatibility/electromagnetic interference (EMC/EMI) problems of high-speed digital systems. In 1998, he decided in favor of an academic career and accepted a position at the Electrical Engineering Department, National Sun Yat-Sen University. Since 2006, he has been a Professor in the Department of Electrical Engineering and Graduate Institute of Communication Engineering (GICE), NTU. His research interests include EMC/EMI and signal/power integrity design for high-speed digital/optical systems. Tzong-Lin was appointed as the Director of the GICE and Communication Research Center in NTU in 2012. GICE is among the best institutes in Taiwan with 41 faculty members and about 450 graduate students, where over 30% of the professors are Fellows of the IEEE. The research direction of GICE includes EM wave, communication, and multimedia.

Tzong-Lin received the Excellent Research Award and the Excellent Advisor Award from National Sun Yat-Sen University in 2000 and 2003, respectively, the Outstanding Young Engineers Award from the Chinese Institute of Electrical Engineers in 2002, and the Wu Ta-You Memorial Award from the National Science Council (NSC) in 2005, Outstanding Research Award from NSC in 2010 and 2014, and the IEEE Transactions on Advanced Packaging Best Paper Award in 2011. He has served as the Chair of the Institute of Electronics, Information and Communication Engineers (IEICE) Taipei Section in 2007-2011, the Treasurer of the IEEE Taipei Section in 2007-2008, and was a member of the Board of Directors of the IEEE Taipei Section in 2009-2010 and 2013-2016. He served the IEEE EMC Society as a Distinguished Lecturer for the period 2008–2009. He was Co-Chair of the 2007 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) workshop, General Chair of the 2015 Asia Pacific EMC Symposium (APEMC), and Technical Program Chair of the 2010 and 2012 IEEE EDAPS Symposiums. He is now the Associate Editor of IEEE Transactions on EMC and IEEE Transactions on CPMT. Dr. Wu is IEEE Fellow.

Dan OhClass VI – Dan Oh, Altera Corp., San Jose, CA, USA

Dan Oh is a Signal and Power Integrity (Si/Pi) Architect at Altera where he is responsible for leading cross functional SI/PI co-design teams including IC design, packaging, and product engineering as well as driving the overall Si/Pi technical direction. Dr. Oh was most recently a Technical Director at Rambus Inc. where he defined the signaling roadmap, supported system definition of new product proposals, and drove IP development for innovative signaling solutions. He has over 25 years of experience in the area of signal and power integrity. Dr. Oh received his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign. He has numerous patents and papers in the areas of high-speed I/O modeling, simulation, and design. He is the lead author of the book High-speed Signaling: Jitter Modeling Analysis, and Budgeting, and also serves on the technical program committees of leading conferences such as IEEE EPEPS, IEEE ECTC, IEEE EMC SIPI, and DesignCon.