SPECIAL EVENTS

Join us for THREE very Special Events
at the 2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity
 

• Keynote Presentation by Dr. Thomas Lee •

• Panel of Experts •

• Technical Plenary Session •


Tuesday, March 17, 2015:  8:30 – 10:00am
Mission City Ballroom 1

Featured Event 

Abstract:

    Over the last century, electronics has so insinuated itself into the fabric of civilization that hardly any aspect of our lives is not dependent on it. This talk will present the history of three events that underscore the fragility of what we have built. We've been remarkably lucky so far, but perhaps we should have a strategy, too.

     Starfish Prime answered the question of what detonating an H-bomb above ground might do to electronics. On 9 July 1962, the US exploded a 1.4-megaton thermonuclear device a few hundred miles above Johnston Atoll in the Pacific Ocean. The effects were much stronger and more varied than anticipated. Radio communications as far away as Australia and California were disrupted. EMP knocked out or otherwise caused to malfunction hundreds of traffic lights in Honolulu, as well as numerous garage-door openers and microwave telephone relays. Perhaps its most famous victim, however, was Telstar, the first active telecommunications relay satellite, which had the misfortune of launching a day after Starfish Prime. The large flux of high-energy electrons produced by Starfish rapidly degraded Telstar's electronics, and rendered the bird silent within four months.

    Hazards of this scale are not all due to avoidable human action. In 1859, telegraphers were shocked -- figuratively and literally -- by dramatic and puzzling phenomena. Sparks jumped across the gaps of telegraph keys; links functioned even when batteries were disconnected; and messages were received that had not been sent. At the same time, brilliant auroral displays were visible at unusually low latitudes. The British amateur astronomer Richard Carrington connected these occurrences to a solar flare he'd observed on 1 September. Today we know that a huge coronal mass ejection (CME) from the sun was ultimately responsible for these effects. A reminder that dangerously powerful CMEs are by no means rare came in 1989. A large CME-induced geomagnetic storm hit Quebec on 9 March, causing a massive regional power blackout within 90 seconds. Had it been a Carrington-level event, the damage could have been as high as a trillion dollars. That risk remains unmitigated today.


Thomas H. Lee is an electrical engineering professor at Stanford University. In 1994 he founded the Stanford Microwave Integrated Circuits Laboratory. He has written and co-authored several books and papers, and recently concluded a tour of duty as the director of DARPA's Microsystems Technology Office.


Panel of Experts

Our panel discussions have been designed to provide an opportunity for attendees to hear several individuals knowledgeable about specific issues or topics present information and discuss personal views. Our intent is to help you further clarify and evaluate your positions regarding the subjects being discussed and increase your understanding of the positions of others.

The EMCSI 2015 committee has identified current matters relevant to various industries in EMC and SI and we have invited a group of panelists with specialized experience in each area. Our response from our experts has been extremely enthusiastic and we hope you are as eager to attend as we are to introduce this new event. Let's get some great dialogue started!

The following topics will be discussed:

Optimizing Interference Control Using Material Science
Chair:  Mark Montrose, Montrose Compliance Services, Inc.,  Santa Clara, CA

When: Tuesday, March 17, 2015: 1:30 –3:00pm  •  Grand Ballroom E

Panelists:

Parisa Faraji, GrafTech International
David Green, ARC Technologies
Mark Montrose, Montrose Compliance Services
Emmanuel Decrossas, Jet Propulsion Laboratory
Joe Heeter, Boeing

Abstract:

Material science plays a significant role in all aspects of a system design.  This panel discusses use of different construction material found in every system design to minimize development and propagation of unwanted EMI in addition to enhancing immunity protection.

The first panelist will discuss emerging hybrid EMI shielding structures and their feasibility for high volume applications.  The second panelist will present aspects of absorber material and their principles of operation including various test methodologies for quantifying absorber effectiveness.  A third panelist will discuss printed circuit board construction material that affects signal integrity and which is the primary cause of common-mode current development in high-speed circuit designs.  The fourth panelist covers carbon nanotube/graphene based composite materials for EMI shielding applications.  The final panelist will present use of composite materials for both shielding and immunity protection utilized in transportation systems.


Brazil, Argentina, Mexico Regulatory Updates, Trends and Best Practices for Successful Product Certification
Chair: Elizabeth Perrier, ORBIS Compliance, Morgan Hill, CA

When: Tuesday, March 17, 2015: 3:30 –5:30pm  •  Grand Ballroom E

Panelists:

Elizabeth Perrier, MTM, ORBIS Compliance LLC
Rodrigo Andrietta, IBEC Laboratories - Brazil
Keith E. Ripley, Temas Actuales LLC

Abstract:

This panel will provide an analysis of regulatory processes for product compliance with regulatory bodies in Brazil ( ANATEL and INMETRO ), and Mexico (NYCE and IFETEL). The panel will also discuss regulatory information about rapidly evolving WEEE compliance in Latin America. An in-depth review of laws covering 2.4 GHz – 5 GHz, 900 MHz and DFS bands and a description of EMC testing, RF Testing, Safety testing (over voltage test), and plug type will included, as well as best practices to successful product certification in both countries.

Included in the discussion are the Telecommunications Trends in the region, infrastructure investment to address the growth of mobile use and the regulations that are needed to support that growth. Topics such as the adoption of 700 MHz band, UWB, Femtocell, adoption of 4G technology and new antenna laws will be discussed. Brazilian and Mexican Testing laboratory representatives will be part of the panel providing a great opportunity for attendees to get answers straight from the incountry testing laboratories.

An expert in WEEE compliance in Latin America will share regulations on packaging, waste and hazardous substances and provide in-depth information on waste/recycling policies in Latin America.

Objectives:

  • To provide the most in-depth regulatory and technical workshop in relation to Brazilian regulatory bodies ANATEL and INMETRO, Mexico NYCE and IFETEL. In addition provide important WEEE Take Back Program laws for Latin America.
  • To share the latest regulatory changes and telecommunications trends that will affect the development and deployment of equipment.
  • To share proven steps to follow for successful product certification in Brazil



Are EMC/SI/PI Closely Related now or in the Future?
Chair: Bruce Archambeault, Archambeault EMI Enterprises, Four Oaks, NC

When: Wednesday, March 18, 2015: 1:30 –3:00pm  •  Grand Ballroom E

Panelists:

Bruce Archambeault, Missouri University S&T, Archambeault EMI
James Drewniak, Missouri University S&T
Rick Brooks, Cisco
Jay Diepenbrock, Lorom
Mike Violette, Washington Labs

Abstract:

In the past, the disciplines of EMC, Signal Integrity (SI) and Power Integrity (PI) was separate and analysis was usually performed by completely different engineers.   However, the time has already come where for most system designs these disciplines can not be separate and must be considered together.  This panel will discuss how and why these areas need to be considered simultaneously and the dangers of not doing so.


Electrical Characterization of High Frequency Interconnects at Bandwidths up to 50 GHz
Chair: Xiaoning Ye, Intel, Portland, OR, USA

When: Wednesday, March 18, 2015: 3:30 –5:30pm  •  Grand Ballroom E

Panelists:

Brice Achkir, Cisco Systems, Inc.
Sam Conner, IBM Corporation
Jay Diepenbrock,  Lorom America
Jun Fan,  Missouri University S&T
Jim Nadolny, Samtec Inc.
Kai Xiao, Intel Corporation
Xiaoning Ye,  Intel Corporation

Abstract

As high speed interconnect data rate increases (up to 25Gbps and above beyond 25 Gb/s), the need for an accurate interconnect measurement is ever critical.  However, there is a lack of standard practices on how to measure interconnect at high frequencies:

 Most instruments (such as VNA, TDR/TDT) can make good measurements at the end of a coaxial cable. However, test fixtures need to be inserted between an instrument’s coaxial interface and the DUT (PCB, package, connector, cable, etc.).  There are various de-embedding approaches already commercially available, however, the de-embedding algorithms are often proprietary, and verification of the accuracy of the computed S parameters is left to the user.

A poorly designed test-fixture can lead to inaccurate de-embedded S parameters. An IEEE standard is needed to specify the electrical requirements of a properly designed test fixture to achieve high quality de-embedding.

The quality of measured S parameter of DUT can vary widely. There is no IEEE standard to check and validate the quality of S parameters before they are distributed for use. This has created many complications for engineers who are constructing models for high speed interconnect analysis. An IEEE standard is needed to check S parameters quality right after they are obtained in lab measurement.

In this panel discussion, the panelists will share their thoughts on how to address the above challenges of ensuring the quality of measured data for high frequency interconnect at bandwidths up to 50GHz. This might include but not limit to: recommended design of test fixturing, methods and processes for ensuring the accuracy and consistency of measured data for broadband signals with frequency content up to 50GHz.



ESD in Data Centers
Chair:  David Pommerenke, Missouri University of Science & Technology, Rolla, MO

When: Thursday, March 19, 2015: 1:30 –3:00pm  •  Grand Ballroom E

Panelists:

David Pommerenke, Missouri University S&T
Kwanghoi Koo, Amazon
Doug Smith, D. C. Smith Consultants
Bob Vermillion, RMV Technology Group

Abstract:

Reliability is a core goal for data center operations. Energy saving can be achieved by allowing a higher range of humidity and temperature within the data center. However, at low humidity the risk for ESD inflicted damage or upsets increases. The panel discussion will present material that analyzes the risk of upset or damage as a function of humidity for data centers and shows how flooring and foot wear can control the risk. Further, it provides data on the charge voltage and probability distribution for ESD induced by walking and other ESD causing events, such as sitting up from a chair.

 


 

Plenary Session

Four 45 minute talks in a ½ day (3 hour) session scheduled
to not compete with the key note speeches with a break in the middle.

Thursday, March 19, 2015 – 8:30am – Noon
Ballroom E

 
Format:
Four 45 minute talks in a ½ day (3 hour).

Description:
This year we are offering a ½ day plenary session highlighting the advances in EMC and SI and the challenges facing us. Four excellent speakers will give insight from their experience on addressing electrical emissions, propagation and susceptibility across a broad range of emerging technologies.  This session will give the attendee a great appreciation for the breadth of components and designs and the innovative techniques for analysis and characterization and get them thinking about the application to their own research and development.


Co-Chairs:
Dale Becker, IBM, Poughkeepsie, NY, USA
Jun Fan, Missouri University of Science and Technology, Rolla, MO, USA


Plenary Presentations:

“The Future of EMC and SI Engineering,” Bruce Archambeault, Missouri University of Science and Technology, Rolla, MO, USA

“Challenges and Opportunities for Power Delivery,” Madhavan Swaminathan, Georgia Institute of Technology, Atlanta, GA, USA

“Nanotechnology in EMC,” Er-Ping Li, Zhejiang University & Institute of High Performance Computing, Singapore

“Advanced packaging for EMC/SI/PI,” James Drewniak, Missouri University of Science and Technology, Rolla, MO, USA